New Digital Camera Modules Bring Tiny Form Factors and Ease of Manufacturing to Cell Phone and Laptop Computer OEMs
SAN JOSE, Calif., October 1, 2007 — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced sample availability for a new line of ultra-compact camera modules featuring its Dynastron image sensor technology. This new family of camera modules, which include the TCM9200MD, TCM9100MD and the TCM9000MD, were developed using Toshiba's chip scale camera module (CSCM) manufacturing technology and are the first to use through chip via (TCV) technology. CSCM allows the mounting and assembly of camera module components in the semiconductor wafer during the module's manufacture. This delivers an approximate 64 percent reduction in module size in comparison to other modules using the same sensor, a significant benefit for camera phones and laptop computers with challenging design footprint requirements.
In addition to allowing camera module components to be integrated in the wafer, Toshiba's TCV technology uses a chip structure with built-in pass through electrodes and solder balls on the rear of the wafer. Accordingly, CSCM camera modules have tighter pixel pitch leads and require no wire bonding space, yielding a smaller overall module size.
"Mobile phone and laptop computer OEMs are increasingly concerned with implementing their new product designs in smaller and smaller form factors. This is being done to meet end user demand for sleeker, more compact mobile devices," said Andrew Burt, vice president of the Imaging and Communications Marketing Group in the ASSP Business Unit at TAEC. "Our new line of digital camera modules incorporates Toshiba's latest manufacturing innovation, CSCM, and our industry-leading Dynastron image sensor technology to help our customers incorporate digital camera functionality into their next-generation cell phones and notebooks without having to make any compromises in regards to size or performance."
Key features of the TCM9200MD, TCM9100MD and TCM9000MD camera modules include:
- TCM9200MD: 2 megapixel (UXGA
- TCM9100MD: 1.3 megapixel (SXGA)
- TCM90 00 MD: 0.3 megapixel (VGA)
- Module size (all sizes provisional):
- TCM9200MD: 6.3mm (L) × 6.4mm (W) × 4.6mm(H)
- TCM9100MD: 5.8mm (L) × 6.0mm (W ) × 4.2mm(H)
- TCM9000MD: 4.0 mm (L) x 4.0mm (W) x 2.5mm (H)
- Frame rates:
- TCM9200MD: 15 frames/sec. (UXGA output), 30 frames/sec. (VGA output)
- TCM9100MD: 15 frames/sec. (SXGA output), 30 frames/sec. (VGA output)
- TCM9000MD: 30 frames/sec (VGA out put only)
- YUV422/RGB565/RGB444/RAW output signal
- Auto white balance, auto luminance control and blemish correction
- 8-bit parallel output format
- I2C interface
Pricing and Availability
Mass production for the TCM9200MD , TCM9100MD and TCM9000MD camera modules is planned for January, February and June 2008 respectively. The evaluation price in 1,000 unit quantities for the TCM9200MD is $50 each, $40 each for the TCM9100MD and $30 each for the TCM9000MD.
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Toshiba Launches New Line of Ultra-Compact Camera Modules Featuring Dynastron® Image Sensor Technolo
DPNow Toshiba Launches New Line of Ultra-Compact Camera Modules Featuring Dynastron® Image Sensor Technolo
Toshiba America Electronic Components, Inc. (TAEC), announced sample availability for a new line of ... (more)